Insights in Analytical Electrochemistry Open Access

  • ISSN: 2470-9867
  • Journal h-index: 7
  • Journal CiteScore: 2.35
  • Journal Impact Factor: 1.67
  • Average acceptance to publication time (5-7 days)
  • Average article processing time (30-45 days) Less than 5 volumes 30 days
    8 - 9 volumes 40 days
    10 and more volumes 45 days

Feng Qiao

Feng Qiao
Department of Chemical Engineering, 801 Mudd Building, 500 W120th Street, New York, NY 10027
Columbia University,

Biography

Iââ

Research Interest

Copper nucleation during direct electroplating onto foreign substrate; Plating electrolyte additives (suppressor, leveler, accelerator, etc.) analysis; Electroplating current distribution simulation; Alloy plating methods and processes; Novel electroplating tool design; Novel electrochemical analysis method.